SMT Universal lead-free solder paste SAC305-5B
SMT Universal Lead-Free Solder Paste SAC305-5B. This high-quality solder paste is designed for chip printing reflow free cleaning. With its SAC305 alloy content and melting points of 217-219°C, it ensures reliable soldering with bright joints. Ideal for mobile, wearable, and tablet devices with small components. Not suitable for HASL process. Shelf life: 6 months. Lead and halogen-free. Ensure superior soldering results with SAC305-5B.
Description
Characteristic:
- Printing SPI one-time pass-through rate is better. (Ultra-fine spacing products require customers to produce with nano steel mesh)
- Bright solder joint, residual beige, QFN side climbing tin medium upward, cavity raate medium upward
- Applicable to OSP process products, or OSP+ENIG process products.
Application fields:
- mobile,
- wearable device,
- tablet personal computer which has 0201 and 01005 components.
Remarks:
- Not suitable for HASL process products, may appear dewetting phenomenon.
- 5# requires the factory to start nitrogen reflux welding to prevent the phenomenon of grape balls in ultra-fine spacing products.
Additional information
| Alloy content | SAC305 |
|---|---|
| Process classification | Chip printing reflow free cleaning |
| Ball size | 5# |
| Melting points | 217-219℃ |
| Shelf life | 6 months |
| Lead | PB free |
| Halogen Free | Halogen free |
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