SMT Universal lead-free solder paste SAC305-5B

SMT Universal Lead-Free Solder Paste SAC305-5B. This high-quality solder paste is designed for chip printing reflow free cleaning. With its SAC305 alloy content and melting points of 217-219°C, it ensures reliable soldering with bright joints. Ideal for mobile, wearable, and tablet devices with small components. Not suitable for HASL process. Shelf life: 6 months. Lead and halogen-free. Ensure superior soldering results with SAC305-5B.



  1. Printing SPI one-time pass-through rate is better. (Ultra-fine spacing products require customers to produce with nano steel mesh)
  2. Bright solder joint, residual beige, QFN side climbing tin medium upward, cavity raate medium upward
  3. Applicable to OSP process products, or OSP+ENIG process products.

Application fields:

  • mobile,
  • wearable device,
  • tablet personal computer which has 0201 and 01005 components.


  1. Not suitable for HASL process products, may appear dewetting phenomenon.
  2. 5# requires the factory to start nitrogen reflux welding to prevent the phenomenon of grape balls in ultra-fine spacing products.

Additional information

Alloy content


Process classification

Chip printing reflow free cleaning

Ball size


Melting points


Shelf life

6 months


PB free

Halogen Free

Halogen free

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