SMT Universal lead-free solder paste SAC305-4BEF

Introducing the SMT Universal Lead-Free Solder Paste SAC305-4BEF. No refrigeration needed. Achieves superior SPI pass rate. Produces bright, residue-free joints. Solves HIP and NWO defects in BGA soldering. Suitable for OSP+ENIG processes. Not recommended for HASL. Ideal for consumer electronics, white goods, automotive electronics, and more. SAC305 alloy, 217-219°C melting points. Shelf life: 6 months. Lead-free, zero halogen. Trust SAC305-4BEF for reliable soldering.



  1. The product is free from refrigeration, and the SPI one-time pass rate is superior.
  2. Bright solder joint, colorless and transparent residue.
  3. Solve the HIP and NWO defects of BGA solder joints.
  4. Low cavity, high electrical reliability.
  5. Applicable to OSP+ENIG process products.
  6. Not suitable for HASL, the effect of climbing tin is mediocre. There is no problem with good plates.

Application fields:

  • Consumer electronics: computer motherboard, tablet, accessories (graphics card, network card), control board, printer, fax machine, projector, etc
    White goods high-end products (air conditioning, washing machine, refrigerator, etc.), kitchen and bathroom appliances, power tools,
    Black appliances (TV, monitor)
    Cell phone battery, protective plate, connector
    Bluetooth headset, FPC soft board
  • Industrial electronics: industrial control motherboard, UPS power supply
  • Automotive electronics: central control, collector, lights, power supply, car navigator, green instrument
  • Rail traffic: IGBT module

Additional information

Alloy content


Process classification

Chip printing reflow free cleaning

Ball size


Melting points


Shelf life

6 months


PB free

Halogen Free

Zero halogen

Recently added products