SMT Universal lead-free solder paste SAC305-4BEF
Introducing the SMT Universal Lead-Free Solder Paste SAC305-4BEF. No refrigeration needed. Achieves superior SPI pass rate. Produces bright, residue-free joints. Solves HIP and NWO defects in BGA soldering. Suitable for OSP+ENIG processes. Not recommended for HASL. Ideal for consumer electronics, white goods, automotive electronics, and more. SAC305 alloy, 217-219°C melting points. Shelf life: 6 months. Lead-free, zero halogen. Trust SAC305-4BEF for reliable soldering.
Description
Characteristic:
- The product is free from refrigeration, and the SPI one-time pass rate is superior.
- Bright solder joint, colorless and transparent residue.
- Solve the HIP and NWO defects of BGA solder joints.
- Low cavity, high electrical reliability.
- Applicable to OSP+ENIG process products.
- Not suitable for HASL, the effect of climbing tin is mediocre. There is no problem with good plates.
Application fields:
- Consumer electronics: computer motherboard, tablet, accessories (graphics card, network card), control board, printer, fax machine, projector, etc
White goods high-end products (air conditioning, washing machine, refrigerator, etc.), kitchen and bathroom appliances, power tools,
Black appliances (TV, monitor)
Cell phone battery, protective plate, connector
Bluetooth headset, FPC soft board - Industrial electronics: industrial control motherboard, UPS power supply
- Automotive electronics: central control, collector, lights, power supply, car navigator, green instrument
- Rail traffic: IGBT module
Additional information
| Alloy content | SAC305 |
|---|---|
| Process classification | Chip printing reflow free cleaning |
| Ball size | 4# |
| Melting points | 217-219℃ |
| Shelf life | 6 months |
| Lead | PB free |
| Halogen Free | Zero halogen |
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