SMT Universal lead-free solder paste SAC305-4B

Introducing the SMT Universal Lead-Free Solder Paste SAC305-4B. Designed for chip printing reflow free cleaning, it ensures reliable soldering with bright, colorless joints. Ideal for fine spacing devices and precision products. Applicable to OSP+ENIG process. Suitable for consumer electronics, white goods, automotive electronics, and more. Not recommended for defective PCBs or HASL process. Trust SAC305-4B for superior soldering results.



Fine spacing product printing SPI one-time pass rate is superior. 2: bright solder joint, colorless and transparent residue.
Fine spacing devices and devices below 0402 pay attention to the solder joint grape ball problem.
Mobile phones, smart watches, special solder paste for precision products.
Applicable to OSP+ENIG process products.

Application fields:

Consumer electronics: computer motherboard, tablet, accessories (graphics card, network card), control board, printer, fax machine, projector, etc
White goods high-end products (air conditioning, washing machine, refrigerator, etc.), kitchen and bathroom appliances, power tools,
Black appliances (TV, monitor)
Cell phone battery, protective plate, connector
Bluetooth headset, FPC soft board
Industrial electronics: industrial control motherboard, UPS power supply
Automotive electronics: central control, collector, lights, power supply, car navigator, green instrument
Rail traffic: IGBT module


Defective PCB board, 0201 small devices, easy to appear grape ball appearance.
Not applicable to HASL process PCB, prone to grape ball appearance.

Additional information

Alloy content


Process classification

Chip printing reflow free cleaning

Ball size


Melting points


Shelf life

6 months


PB free

Halogen Free

Halogen free

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