Description

Characteristic:

Fine spacing product printing SPI one-time pass rate is superior. 2: bright solder joint, colorless and transparent residue.
Fine spacing devices and devices below 0402 pay attention to the solder joint grape ball problem.
Mobile phones, smart watches, special solder paste for precision products.
Applicable to OSP+ENIG process products.

Application fields:

Consumer electronics: computer motherboard, tablet, accessories (graphics card, network card), control board, printer, fax machine, projector, etc
White goods high-end products (air conditioning, washing machine, refrigerator, etc.), kitchen and bathroom appliances, power tools,
Black appliances (TV, monitor)
Cell phone battery, protective plate, connector
Bluetooth headset, FPC soft board
Industrial electronics: industrial control motherboard, UPS power supply
Automotive electronics: central control, collector, lights, power supply, car navigator, green instrument
Rail traffic: IGBT module

Remarks:

Defective PCB board, 0201 small devices, easy to appear grape ball appearance.
Not applicable to HASL process PCB, prone to grape ball appearance.