Introducing the SMT Universal Lead-Free Solder Paste SAC105-4A. This solder paste is designed for reliable and efficient soldering in various applications. It offers the following key features:

• Bright solder joint with colorless and transparent residue, ensuring visually appealing results.
• High one-time pass rate for printing SPI, reducing rework and maximizing productivity.
• Specifically designed to meet the production needs of conventional OEM factories.
• Applicable to OSP, ENIG, and HASL processes, supporting solder joints of 0201 size and 0.4 pitch without the occurrence of grape ball phenomenon.

The SAC105-4A solder paste finds its application in the field of consumer electronics. It is suitable for feature phones, white goods, black appliances, e-cigarettes, and small appliances.

Experience excellent soldering performance with SAC105-4A. Achieve bright and reliable solder joints with a high printing SPI pass rate. It is designed to cater to the production requirements of OEM factories and is versatile enough to be used in various consumer electronic products.