LED solder paste SL-P-LF300 Sn99Ag0.3Cu0.7
LED Solder Paste LF300, a high-quality solder paste designed for LED applications. It delivers bright solder joints with colorless and transparent residue. Ideal for LED projects. Alloy content: Sn99Ag0.3Cu0.7. Melting points: 217-227°C. Shelf life: 6 months. Lead and halogen-free. Choose LF300 for reliable LED soldering.
Description
Characteristic:
Bright solder joint, colorless and transparent residue.
Application fields:
LED
Additional information
| Alloy content | Sn99Ag0.3Cu0.7 |
|---|---|
| Process classification | Chip printing reflow free cleaning |
| Ball size | 3# |
| Melting points | 217-227℃ |
| Shelf life | 6 months |
| Lead | PB free |
| Halogen Free | Halogen free |
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