LED solder paste LF9300
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LED solder paste SL-P-LF2002 Sn64Bi35Ag1

Introducing LED Solder Paste LF2002, a versatile solder paste designed for LED applications. It offers moderate activity and good fluidity, making it suitable for medium-temperature printing and dispensing. Ideal for LED projects. Alloy content: Sn64Bi35Ag1. Melting points: 151-179°C. Shelf life: 6 months. Lead and halogen-free. Choose LF2002 for reliable LED soldering.

Description

Characteristic:

  1. Moderate activity, good fluidity, suitable for printing, dispensing medium temperature scene.

Application fields:

  • LED.

Remarks:

  1. The welding strength is about 60% of SAC305.

Additional information

Alloy content

Sn64Bi35Ag1
Process classification

Chip printing reflow free cleaning, Dispensing reflux free cleaning
Ball size

3#, 4#
Melting points

151-179℃
Shelf life

6 months
Lead

PB free
Halogen Free

Halogen free

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