Low solide flux SL-F-WTO-518E-2
SL-F-WTO-518E-2 consists of enhanced rosin & resin, organic activating agents, diverse additives, and solvents. It exhibits top-notch soldering capabilities, producing shiny and complete solder joints with impressive tin-penetration and even distribution. Designed to work with the welding temperatures of various lead-free solders, it stands as an ideal No-clean flux for leadless soldering applications.
Description
Features:
- Reduced surface tension with superior solderability and fluidity.
- Excellent wettability and tin-penetration ability.
- After welding, residues are evenly spread, resulting in a clean finish and dependable electrical integrity.
- This flux is environmentally friendly and meets RoHS standards.
Application:
It is extensively used with leadless solder in various sectors, including power products, computer motherboards, display cards, communication devices, audio equipment, cooling systems, medical devices, and more. The application methods include techniques of spraying, dipping, and foam expansion.
Additional information
| Halogen Free | Halogen free |
|---|---|
| Solid content | 2,4 ±0,8 |
| Flux Classification | REL0 |
| Appearance | Clean, Pale Yellow Liquid |
| Specific Gravity(g/cm3@20°C) | 0,800 ± 0,005 |
| Acid Value (mg KOH/g) | 20,00 ± 5,00 |
| Expansion rate (%) (SnPb) | ≥75 |
| Chromate Paper Test | Pass |
| Copper Mirror Corrosion | Pass |
| Corrosion Test | Pass |
| SIR (Ω) | ≥1.0×108 |
| ECM | Pass |
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