Low solide flux SL-F-WTO-518E
SL-F-WTO-518E is formulated with superior enhanced rosin & resin, organic activating agents, and different additives and solvents. This product exhibits exceptional solderability, bright and full soldering spots, and the capability for good tin penetration and uniform distribution. It’s suitable for the soldering requirements of various lead-free solders, making it an optimal no-clean flux for lead-free soldering applications.
Description
Features:
- With low surface tension, this product offers excellent solderability and flowability.
- Its strong wettability and outstanding tin-penetration capability can effectively make up for the poor tin-penetration ability commonly associated with lead-free solder.
- Residues after welding are minimal and spread uniformly.
- It provides superior performance in ICT testing.
- This flux is environmentally friendly and does not contain substances banned by RoHS, adhering to environmental protection standards.
Application:
It is suitable for various lead-free solders and finds widespread application in computer motherboards, video cards, communication devices, audio equipment, cooling systems, medical devices, and more. It can be utilized with spraying, dipping, and expanding foam techniques.
Additional information
| Halogen Free | Halogen free |
|---|---|
| Solid content | 2,8 ±0,8 |
| Flux Classification | REL0 |
| Appearance | Pale Yellow Transparent Liquid |
| Specific Gravity(g/cm3@20°C) | 0,807 ± 0,010 |
| Acid Value (mg KOH/g) | 22,00 ± 5,00 |
| Expansion rate (%) (SnPb) | ≥75 |
| Chromate Paper Test | Pass |
| Copper Mirror Corrosion | Pass |
| Corrosion Test | Pass |
| SIR (Ω) | ≥1.0×108 |
| ECM | Pass |
| RoHS | Pass |
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