High solid flux SL-F-WTO-718HF
WTO-718HF No-clean Lead-free Soldering Flux is formulated with top-tier modified rosin resin, organic activating substances, diverse additives, and solvents. This flux provides exceptional soldering performance, resulting in well-filled, shiny solder joints, and offers excellent tin permeability along with uniform tin coating. It has been crafted to satisfy the soldering requirements of various applications.
Description
Features:
- Significantly lowers the surface tension of lead-free solder, enhancing both its fluidity and soldering capability.
- Offers robust wetting strength and superior tin permeability through holes, effectively compensating for lead-free solder’s inherently poor tin permeability.
- The residues after welding are uniformly distributed, resulting in a polished finish and exceptional electrical reliability.
- Free from RoHS and other environmentally restricted substances, it qualifies as an eco-friendly flux.
Application: This flux is adaptable for use with various lead-free solders across different electronic sectors, including power supply units, computer motherboards, graphics cards, communication devices, audio and video equipment, cooling systems, medical equipment, etc. It is suitable for spray, dip, and foaming processes.
Additional information
| Flux Classification | REL1 |
|---|---|
| Nonvolatile content (wt%) | 10,80±0,80 |
| Halogen Free | Halogen free |
| Specific Gravity(g/cm3@20°C) | 0,818 ±0,010 |
| Acid Value (mg KOH/g) | 34.,50±5,00 |
| Expansion rate (%) (SnPb) | ≥80 |
| Copper Mirror Corrosion | Pass |
| Corrosion Test | Pass |
| SIR (Ω) | ≥1.0×108 |
| ECM | Pass |
| RoHS | Pass |
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